Technology and Science

President Lai Breaks Ground at New Kaohsiung Semiconductor Hub

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By TaiwanPlus

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President Lai Ching-te has helped break ground at the Baipu Industrial Park in Kaohsiung, a new semiconductor hub planned for southern Taiwan. The government expects the industrial park to create around 4,000 jobs and generate US$9.4 billion annually. It will include two facilities planned by global semiconductor leader TSMC. Lai said the hub will focus primarily on development and testing, allowing companies bring products to market faster. The industrial park is set for completion in 2031.