Taiwan could lead the next era of semiconductors, according to Patrick Vandenameele, the CEO of IMEC, the world’s top semiconductor research center. He says the semiconductor roadmap could extend far into the 2040s, with new transistor designs among the technologies being developed. The next leap in chip efficiency will depend on combining different technologies so chips can handle more data while using less power. TSMC is also making progress in advanced packaging, including co-packaged optics.
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