TSMC and Amkor Announce 10-Year Packaging Deal in Arizona
TSMC’s US Manufacturing
REPORTER:
Two of the world’s largest chip firms have announced a partnership on a vertically integrated manufacturing base in the US.
Taiwan’s TSMC and Amkor, the biggest chip packaging company in the US, announced a 10-year agreement to localize semiconductor production in Arizona. The deal will see Amkor build a new $7 billion US dollar facility near TSMC’s US factory in Phoenix. Packaging is the final stage of the chip manufacturing process, where silicon components are encased in a protective layer.
---
TSMC-Amkor Partnership
REPORTER:
Two of the world’s largest chip firms have announced a partnership to create a vertically integrated manufacturing base in the US.
TSMC and Amkor, the US’ biggest chip packaging company, announced a 10-year partnership to localize the semiconductor production process to Arizona. The deal will see Amkor build a new $7 billion US dollar facility near TSMC’s US manufacturing base in Phoenix, Arizona. Packaging is the final stage of the semiconductor manufacturing process, which encases silicon components that are encased in a protective layer.
