TSMC Expands Advanced Packaging Capacity at Chiayi Science Park
TSMC is expanding its advanced packaging capacity in southern Taiwan with three new packaging fabs planned at the Chiayi Science Park. The news came during the groundbreaking ceremony for Phase II of the park, which aims to become a major advanced chip packaging hub by 2031. TSMC’s Phase I plants have begun mass production this summer, with the completed park expected to generate over US$9 billion in annual output.
Science Park Groundbreaking
REPORTER:
TSMC is set to build three new packaging fabs in southern Taiwan to meet growing global demand for advanced chips. The expansion was announced during a groundbreaking ceremony for Phase II of the Chiayi Science Park on Sunday. The site is being developed into an advanced packaging hub, with completion targeted for 2031.
TSMC's two Phase I packaging plants are beginning mass production this summer. Officials estimate the park will generate just over 9 billion US dollars in annual output and create about 9,000 jobs once both phases are complete.
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Science Park Groundbreaking
REPORTER:
TSMC is set to build three new packaging fabs in Phase two of Chiayi Science Park in southwestern Taiwan to meet growing global demand for advanced chips and packaging. This comes as the park’s new Phase two site held its groundbreaking ceremony on Sunday, where the site will be developed into an advanced packaging industry cluster led by the chip giant.
TSMC began mass production at its Phase I facility in the park in June. Officials estimate that once both phases are operational, they will generate over US$9.35 billion in annual output.
