Graphene, 3D Stacking and Photonics: Can Semiconductors Keep Up With AI?

Published

By TaiwanPlus

AI is exploding, but can hardware keep up? At SEMICON Taiwan 2025, Imec President and CEO Luc Van den hove takes us inside the future of semiconductors, from 3D stacking breakthroughs and advanced cooling to new computing paradigms set to redefine performance. From graphene-based chips to lab-on-a-chip biotech and photonics, we explore how the next generation of AI hardware will transform industries worldwide.